Ecological, lead free solder based on tin and copper.
Applied in electronics and electrical engineering.
- the Sn99Cu1 alloy is manufactured acc. to PN EN 29453:2000 Standard in continuous cast process
without air access, then is extruded, what eliminates creation of oxides
- copper content : 0,5% to 0,9%
- flux content : 1,5% to 2,0%
- tin content : the rest
- melting point : eutectic mixture 230°C - 240°C
- operating temperature : 300°C to 380°C
- specific gravity : 7,30 g/cm3
- flux : NO CLEAN - non-corrosive for use in electronics and
electrical engineering. The residues need no removal.
